Amcor Lift-Off Winner WIPE leveraging technology to evaluate packaging quality

Amcor (NYSE: AMCR, ASX:AMC), a global leader in developing and producing responsible packaging solutions, today announced Web-Based Intelligent Packaging Evaluation (WIPE) as the winning student and faculty team of the latest Amcor Lift-Off pitch competition, hosted in partnership with Michigan State University (MSU). WIPE competed for an investment and collaboration opportunity as part of Amcor’s Lift-Off program, an open-call initiative aimed at supporting early-stage start-ups focused on innovative packaging solutions and related technologies.

WIPE, developed by the research group of Dr. Euihark Lee at MSU’s School of Packaging, is an AI-based digital tool designed to leverage information mined from online customer reviews to assess the journey of a package throughout the distribution process. Once collected, the data is categorized for sentiment and key metrics, providing analysis that helps manufacturers identify critical issues during distribution and the consumer experience.
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